SOLVENT-BASED NONCONDUCTIVE PHENOLICS for the electronics industry.

GP® phenolic chemicals for the electronics industry are available in a range of viscosities to meet your specific processing needs. In addition, our epoxy hardeners are used as curing agents for epoxy resins in molding compounds, copper-clad laminates, and electrical applications.

ELECTRONICSSample ApplicationsCharacteristicsViscosity, @25°C, cpsSolvent / Water §Solids/Non-Volatiles, %Phenol, %Formaldehyde, %Water, %Technical Data Sheet
GP 5168Low conductivity for electrical insulationsLow conductivity • Easy processing • Strength400 – 1,200Methanol55 – 598 - 101.0 max.5 -11Download
GP 5236MCircuit boards and their components, high temperature applications, laminatesLow smoke generation • Strength • Fire resistance • Meets the requirements of Military Specification MIL-R-9299C, Type II, Class 2 Grades A & B and Military Specification 64156B300 – 800Methanol/ Ethanol60 – 655 - 122.0 max.5 - 9Download
GP 5236HCircuit boards and their components, high temperature applications, laminatesSame properties as GP® 5236M but with higher processing viscosity1,000 – 2,000Methanol/ Ethanol68 – 725 - 122.0 max.5 - 9Download

§ Contact Georgia-Pacific Chemicals for your specific solvent requirements

EPOXY HARDENER (PHENOLIC NOVOLAC)FormMelt Viscosity @150 °C, cPsSoftening Point, °CHEW* (g/eq OH)Stroke Cure† @ 150 °C, sec (%2 MI)Tg† DSC (°C)Technical Data Sheet
GP 2056Flake1,300 – 1,70099 – 110104107 (0.5)146Download
GP 2074Flake2,800 - 6,500110 - 11810497 (0.5)154Download

* HEW (Hydroxyl Equivalent Weight) is measured by acetylation, NMR or is calculated.
† Using stoichiometric amounts of Epon 828 or Araldite 6010
Epon is a trademark owned by Hexion Inc. Araldite is a trademark owned by Huntsman Advanced Materials Americas LLC.

ELECTRONICS Sample Applications Characteristics Viscosity, @25°C, cps Solvent / Water § Solids/Non-Volatiles, % Phenol, % Formaldehyde, % Water, % Technical Data Sheet
GP 5168 Low conductivity for electrical insulations Low conductivity • Easy processing • Strength 400 – 1,200 Methanol 55 – 59 8  – 10 1.0 max. 5 -11 Download
GP 5236M Circuit boards and their components, high temperature applications, laminates Low smoke generation • Strength • Fire resistance • Meets the  requirements of Military Specification MIL-R-9299C, Type II, Class 2 Grades A & B and Military Specification 64156B 300 – 800 Methanol/ Ethanol 60 – 65 5 – 12 2.0 max. 5 – 9 Download
GP 5236H Circuit boards and their components, high temperature applications, laminates Same properties as GP® 5236M but with higher processing viscosity 1,000 – 2,000 Methanol/ Ethanol 68 – 72 5 – 12 2.0 max. 5 – 9 Download
EPOXY HARDENER (PHENOLIC NOVOLAC) Form Melt Viscosity @150 °C, cPs Softening Point, °C HEW* (g/eq OH) Stroke Cure† @ 150 °C, sec (%2 MI) Tg† DSC (°C) Technical Data Sheet
GP 2056 Flake 1,300 – 1,700 99 – 110 104 107 (0.5) 146 Download
GP 2074 Flake 2,800 – 6,500 110 – 118 104 97 (0.5) 154 Download
PF
Resole
Novolac

PF resins, modified phenolic resins, copper clad laminates, electronic laminating, industrial laminating, electronic molding compounds, circuit board, epoxy hardener, curing agents, non-conductive phenolic, GP